My experience with AS5 and not gluing the lid
I know this is an older thread, but after four successful delids, I just wanted to share my own thoughts....
I use Arctic Silver 5 as the thermal compound for my delids. Is there something better? Probably, but AS5 is relatively inexpensive and works well. I believe that the mistake most people make (if they make a mistake when they delid) is that they glue the lid, thus preventing it from "settling" over time. While it may seem risky to leave the lid unglued, all of my delids are still running (one for multiple years now) with the lid held only by the heatsink mounting pressure. My theory is that this allows the lid and the thermal compound to "settle" and "mate" over time. My only proof that this works is that my CPU core temps continued to equalize and reduce a degree or two over time. After first delidding, I have found that there is inevitably one core that has a lower temp than the others. Over time, this temp difference reduces as the lid / thermal compound "mate."
I've read other posts that warn against the use of AS5 because it "squeezes out." Whats funny about those posts is that is exactly what you want to happen. The fine particles of AS5 should remain only where there are defects in the mated surfaces of the die/lid.
Just my two cents.
